Job Requirement
1. 3+ years experience in tape saw and jig saw of semiconduct ,TSK tape saw and disco jig saw experience will be preferred
3年以上半导体切割经验，有tape saw和jig saw经验者优先
2. 2+ years 8D handle experience
2年以上8D报告的经验
3. Fimilar with QFN/LGA product
熟悉QFN/LGA封装产品
4. Good oral and written english
英语良好
5. Data analysis skill(jmp/minitab etc)
数据分析能力
6. Can work under pressure
抗压能力

Job Description
1. Responsible for singulation saw and pick&place process, new clear compound product development, process parameter set up, abnormal handle, yield improvement.
负责切割和分拣工艺，新产品开发，工艺参数设置，异常处理，良率提高。
2. ｕｐｄａｔｅ　process FMEA/SPEC/SOP/Control Plan etc as the continue i
mprovement tools, to provide technical solution in engineering to achieve yield, quality, cycle time and productivity goals
更新流程FMEA/SPEC/SOP/控制计划等，改进工具，为工程提供技术解决方案，以实现良率、质量、周期和生产率目标
3. Response for new materail and engineering evaluation for singulation saw and Pick&place
负责新材料和新工程评估
4. others which supervisor required
主管安排的其他工作事宜